Shenzhen Learnew Optoelectronics Technology Co., Ltd.
The only factory 10 years concentrate on LED chip and LED light R&D and Manufacture.
Add to Cart
Design Advantage:
1.Adopt Mini CNSP (Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology.
2.Thermoelectric separation structure, better heat dissipation.
3.Ultra-thin phosphor film layer, improve light density.
4.Unique copper substrate structure design, easily achieve power density above 100W/cm².
5.Double light intersection grid distribution, more uniform light mixing.
Appilication:
Film and television lights
Photographic lights
Studio lights
Stage lights
